Posted: Wed Oct 11, 2006 4:27 pm Post subject: Diode Array Absorbs uniform heat releases DC electric power
I was granted U.S. patent 3,890,161, DIODE ARRAY in 1975 on a chip typically consisting of billions of nanometer scale diodes which absorbs macroscopically uniform ambient surrounding heat, transforming it into an equivalent release of electrical power. The diodes, in consistent alignment, rectify and aggregate internal radio frequency thermal noise within electronic components (not involving antennas) into D.C. electricity. The diodes are in parallel first so the diode currents bypass each other. The forward current that a random half of the diodes release intermittently overwhelms the low reverse current released by the other half of the diodes. The net forward current of the diodes is aggregated in parallel into useful power at low voltage. Balanced groups of diodes in parallel are then connected in series to build higher voltage. The slight thermal noise of the load is unimportant because it is vastly overwhelmed by the great preponderance of net rectified power.
The electrons move uphill into the buss voltage within the source diode so they loose momentum so they become colder. The loss of thermal energy is equal to the gain of electrical energy released from the buss when electricity is drawn off.
The power needed to alter the width of the depletion region at the junction, which determines the conductivity of a diode, is deducted from the thermal noise leaving net rectified power meaning that less power is needed to sort the random power than is supplied by the random thermal power. This means that a variant of Maxwell's demon, M. Von Smoluchowski's trapdoor, applied to electrons will work. This is a challenge to the Second Law of Thermodynamics.
The concept was tested in 1993 where more power than ~2 nanowatts, the power a single diode can yield, 1 /2 kTB where 1 / 2 accounts for rectification, k=Boltzmann's constant, T=temperature in Kelvins and B= 1 THz, the upper frequency limit of thermal noise, was measured from a chip consisting of ~5,600 Au dot anodes surrounded by SiO2 on a n GaAs substrate. The chip produced ~50 nanowatts as ~50 millivolts across 50 K ohms under commissioned professional test conditions including a uniform temperature bath of stirred pure inert oil, showing feasibility. This was a successful proof of concept prototype. Unfortunately the documentation of this test is poor.
This experiment should be corroborated. Dies better than the one used in 1993 are available. The barely visible die needs to be adapted by adding a conductive layer to the face and leads. I would be pleased to advise at arms length.
Practical diode arrays require nanofabrication of arrays containing a great number of nanometer scale diodes. A test array can be assembled with carbon nanotubes selected to be semiconducting placed between Au and Al rails.
If this works, future appliances would get all the energy they were designed for from ordinary air or water. This energy would be clean, cheap, widely available, safe, quiet, reliable, and not emit greenhouse gas. Furthermore, air conditioning would release electricity instead of consuming it, which is basically more sensible. Small appliances would work cordlessly anywhere in the world out of the box. Many kinds of electric vehicles would become practical. Diode arrays in computers with minor inputs and outputs would recycle the heat from the operating chips so the system would not release heat or need external power while using lots of high power high speed logic.
I want this to be commercialized without fussy licensing restrictions on the diode array or its applications so all humanity can be involved in its synergistic development. NDA's and noncompete requirements are not in this spirit.
First, a prototype development group with great team strength needs to emerge. Later, many application development groups should emerge. Micro angel capitalization is the cleanest form of financing. A smooth, free, and fair market should support useful applications using commodity chips made by commodity equipment.
New applications developers would recover their specific research and development costs with a modest positioning premium on their price.
I would like to hear from people about the diode array. People who don't think that it will work are welcome to state their reasons. I have heard many objections and believe that they do not hold but they are welcome. The people that believe that the diode array will be useful will have different ideas on how to proceed. People with a desire to use the diode array in a particular application or family of applications are also welcome. We can listen to each other and see if the early developmental steps are well supported. Someone may find a place that can assemble and test a group of proof of concept prototypes.
Criteria Labs http://www.criterialabs.com in Austin TX has a good reputation. They will carefully plan what they are to do before proceeding. My general idea is to solder the barely visible die face down on an Au solder clad Au trace. The die face is covered with ~10,000 Au anode dots. This technique will connect all the diodes to the trace without shorting to the n type GaAs substrate. They may be agreeable to be part of a $25,000 project to build 10 - 20 similar prototypes. Part of the money would be used to buy the dies, which are 1T7 s costing $500 each but which may be offered at a much lower unit price if several are bought, from Virginia Diodes Inc. .http://www.virginiadiodes.com The president, a pioneer in high frequency diodes, hates the concept but need not be involved.. Mr. Steven H. Jones, an expert in the field, can provide data on the dies, and process any orders. VDI will not mount the dies. Building several prototypes is a more careful way of testing the concept and provides for more testing by more people. The experimentation can then proceed in spite of the loss or damage of a few prototypes.
The results of the tests will be widely publicized even if an utter failure. If the tests are successful, further group building will be called for.
i am currently prototyping cogeneration technics using thermalcouple devices. at first glance this looks promising. what is your estimation of power efficency? what size and rating would finished product be?
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